HOME PRODUCTS CAPABILITIES ABOUT US MEDIA CONTACT US CAREERS

CAPABILITIES
Semiconductor Packaging
Multi-Chip Packages
Information Assurance
System in a Package
Circuit Card Assembly
Certifications
Obsolescence Management
Supplier Relationships
Thermal Management
PCN, BOM Control, Source Control
Surface Mount Technology
Chip On Board
COTS Technology
Military Temp Memory
RoHS
 


Restriction of Hazardous Substances (RoHS)

Image Here










The 2002/95/EC Directive from the European Parliament and of the Council of 27 January 2003 (RoHS) addresses the elimination and/or control of specified hazardous materials in electronics. Microsemi Corporation is very much aware of these directives and has programs in place to address the specific issues in our products. Materials used in assembly of the products have been reviewed for compliance to the standard as well as any chemicals used in the processes.

Microsemi products are compliant to RoHS, except for the solder used to tin leads, or BGA solder balls. Defense applications are in most cases exempt from the RoHS requirements and there is a preference for use of Sn63 solder due to the long term reliability history with this material set.

However, Microsemi can produce BGAs with lead free solder balls to fully comply with the RoHS requirements. Please contact the factory for your detail requirements.
Product Checklist
Quick Reference Guide
Trrust-Stor
TI_OMAP
WEDC Technology Guide
1GByte DDR3 SDRAM

© 2012 White Electronic Designs. All rights reserved.